We go beyond just package conversion, adapting to your changing requirements from concept to prototype to production.

Typical Applications and Unique Features
* Transparent interface from a new BGA device to existing QFP pads
* Patent-pending solder ball connection offers a robust, process compatible, and

   cost effective replacement for fragile QFP leads
* Solutions to obsolescence for most SMT or thru-hole lead styles
* Sourcing and device attach for passive and active components
* Stand-offs, solder preforms, SMT designs, and more
* Contact our Product Engineers to get started