BGA Interposers 适配器

    生产商: Advanced Interconnections
    产品类别: 适配器
    系列:

    BGA Interposers 适配器

    特性:

    Designed for RoHS exempt applications, Interposers from Advanced solve BGA device transition, obsolescence, and solderability issues associated with the higher temperature requirements to process lead-free BGA packages.

    Advanced's turn-key solution consists of lead-free BGA device attach to an Interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom of the Interposer. The compact Interposer assembly is shipped ready for use on existing PC boards, eliminating the need to change Tin/Lead solder profiles or subject other components to higher processing temperatures.

    * Reduces costs associated with device package transition or obsolescence
    * Lead-free device attach service provided
    * Industry-proven solder ball terminal design provides the high reliability required in
    medical, military, telecom, and automotive applications
    * High temperature FR-4 adapter board closely matches original package size
    * Same footprint as BGA device (currently available in 0.80, 1.00, and 1.27mm pitch)
    * Custom designed to customer's requirements
    * Tape and Reel packaging available
    端子:

    Brass; Copper Alloy C36000, ASTM-B-16
    Solder Ball: Eutectic 63Sn/37Pb

    插座材料: High Temperature FR-4
    产品资料: BGA Interposers 适配器数据表
    参考连结:
    Typical Soldering Process Examples
     

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