生产商: | Advanced Interconnections |
产品类别: | 板对板连接器 |
系列: |
B2B® SMT 连接器
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特性: |
* High density .050" (1.27mm) pitch - over 400 contacts per square inch * Robust screw-machined terminals with multi-finger contacts can withstand the demands of blind mating and rigorous mating/unmating cycles * Precision molded in high temperature LCP with integral polarization keying features to prevent 180° out-of-orientation mismating * At 3 amps per pin, more contacts can be assigned to data/signal transfer (fewer pins needed to handle power and ground) * Guide box design facilitates alignment of male pin into female receptacle while protecting pins from damage during board mating * Industry standard footprints in four mated heights (Standard stack heights: 6.00mm, 8.00mm, 12.70mm and 19.05mm) * Custom configurations available * RoHS Compliant models available featuring new Sn/Ag/Cu solder ball terminals |
端子: |
Brass; Copper Alloy C36000, ASTM-B-16 |
黄片: | Beryllium Copper Alloy C17200, ASTM-B-194 |
插座材料: | High Temp. (Molded) LCP Liquid Crystal Polymer |
产品资料: | B2B® SMT 板对板连接器数据表 |
参考连结: |
1. B2B® SMT Connectors Aerospace Imaging Equipment Application Note
2. Signal Integrity Simulation and Modeling Overview
(SI Profiles, Crosstalk, Eye-Diagrams and Conclusions in PDF format)
a. 6.00mm height
b. 8.00mm height
c. 12.70mm height
d. 19.05mm height
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免费:400-820-8921