An economical and reliable alternative to soldering BGA devices directly to the motherboard, the Advanced® molded BGA Socket Adapter System enables the BGA device to be plugged into a mating socket after soldering to a pinned adapter. Our low insertion force, patented design provides yields that are equivalent to direct attach, with coplanarity consistently better than the industry standard of .006" (0.15mm).
This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in an interstitial pattern - offering the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the device package, this compact design is perfect for development and validation of BGA and LGA devices, production level socketing, and SMT board to board connector applications.
Our Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top™ BGA Sockets require no external hold-downs and use less PC board space than most test sockets. The patent-pending pressure retention clamp, with integral heat sink, ensures a reliable connection.
Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs.
The new Mod5 Series provides a compact, surface mount test solution for micro-BGA chipsets used in applications such as handheld, mobile, and wireless product development. Precision machined spring probes with industry proven solder balls ensure high reliability performance.
Using our exclusive, field-proven eutectic solder ball terminal design, the SMT Adapter from Advanced provides a reliable solution for mounting or socketing LGA or re-worked BGA devices. Use in connection with our BGA Sockets for LGA to BGA conversion or board to board applications.
BGA Device Attach and Solder Ball Re-attach Services are available in our state-of-the-art SMT factory.
New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles.